Electronic circuit chip connection assembly and method

Details Electronic circuit chip connection assembly and method Electronic circuit chip connection assembly and method

1989-05-30

1989-11-07

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 68, 439 73, 357 75, 361400, H01R 909

Patent

active

048788465

ABSTRACT:
This assembly allows connecting in one operation a plurality of chips to chips and to a substrate or each chip to a substrate using an elastomeric pressure means that continues to pressure chips connecting micron sized leads to chip pads on one end and to circuitry on a substrate on the other end; a metallic cover fastening to the substrate and containing said electronic pressure means also includes a ribbed projection to hermetically seal the unit so that the substrate itself becomes an integral part of the assembly package.

REFERENCES:
patent: 3571915 (1971-03-01), Shirland
patent: 4330812 (1982-05-01), Token
patent: 4688150 (1987-08-01), Peterson
IBM Technical Disclosure Bulletin, "Interconnection Alignment Multichip Module", vol. 15, No. 10, Mar. 1973.

Affiliated with

Also associated with

Rating

Electronic circuit chip connection assembly and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit chip connection assembly and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit chip connection assembly and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-80917