Electronic circuit cards with solder-filled blind vias

Details Electronic circuit cards with solder-filled blind vias Electronic circuit cards with solder-filled blind vias

1996-08-19

1998-09-22

Ledynh, Bot L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361772, 439 83, H01R 909

Patent

active

058117369

ABSTRACT:
A printed circuit board has a plurality of layers. A first surface land is formed on an inner layer. A dielectric material is laminated on the inner layer. A second surface land is formed on the dielectric material overlapping the inner surface land or positioned along the border of the inner surface land. A hole is etched in the dielectric material exposing the first surface land to the second surface land. The second surface land does not completely surround the hole. A component lead is positioned over the second surface land. Solder is reflowed into the hole to interconnect the surface lands to each other and to the component lead. Because the second surface land does not completely surround the hole, the solder does not bridge across the hole and thereby forms a solid connection between the first and second surface lands.

REFERENCES:
patent: 3610811 (1971-10-01), O'Keefe
patent: 5220487 (1993-06-01), Patel et al.
patent: 5326937 (1994-07-01), Watanabe
patent: 5373112 (1994-12-01), Kamimura et al.
patent: 5421083 (1995-06-01), Suppelsa et al.
patent: 5429859 (1995-07-01), Young
patent: 5434365 (1995-07-01), Mori et al.
patent: 5451720 (1995-09-01), Estes et al.
patent: 5510580 (1996-04-01), Shirai et al.

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