Electronic circuit bonding interconnect component and flip chip

Details Electronic circuit bonding interconnect component and flip chip Electronic circuit bonding interconnect component and flip chip

1997-05-09

1998-09-08

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257750, 257778, H01L 2348

Patent

active

058048766

ABSTRACT:
An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bonding interconnect is used to bond a die pad to a supporting substrate thereby forming a surface mount device.

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patent: 5235140 (1993-08-01), Reele et al.
patent: 5384284 (1995-01-01), Doan et al.
Tummala, Rao R. & Rymaszewski, Eugene J., "Microelectronics Packaging Handbook", Jan. 1, 1989 pp. 366-391; Van Nostrand Reinhold.

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