Electronic circuit board with semiconductor chip mounted thereon

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

174260, 257723, 361783, 361776, H05K 702, H05K 114, H01R 909

Patent

active

058547401

ABSTRACT:
An electronic circuit board with one or more semiconductor chips installed thereon, and a manufacturing method therefor, are disclosed. The circuit board with semiconductor chips installed thereon includes: one or more semiconductor chips; an insulated circuit board having wire bonding pads for connection to the bonding pads of the semiconductor chips; a plurality of wires connected between the bonding pads of the semiconductor chips and the wire bonding pads of the circuit board; and a plurality of protecting covers for insulating the wires and the semiconductor chips. The circuit board includes an opening smaller than the semiconductor chips, and wire bonding pads formed around the opening. The semiconductor chip includes bonding pads which are formed on the central portion of the surface of the semiconductor chip. The protective cover covers the chip and the wires.

REFERENCES:
patent: 5243497 (1993-09-01), Chiu
patent: 5280192 (1994-01-01), Kryzaniwsky

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