Electronic circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S255000, C174S261000

Reexamination Certificate

active

11322306

ABSTRACT:
A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as solder, and grooves formed in an electrode terminal of the plurality of electrode terminals and capable of accumulating solder or the like. Specifically, a high frequency component is mounted on the front surface of the high frequency device board, and the plurality of electrode terminals are formed on the rear surface of the high frequency device board. A ground electrode terminal included in the plurality of electrode terminals is formed at the center of the rear surface of the high frequency device board and connected to a ground. The grooves for accumulating solder or the like are formed in the ground electrode terminal. This reduces the possibility of short-circuit between adjacent electrode terminals due to the flowable conducting material such as solder.

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patent: 6362435 (2002-03-01), Downey et al.
patent: 6362436 (2002-03-01), Kimbara et al.
patent: 6399896 (2002-06-01), Downes et al.
patent: 6566611 (2003-05-01), Kochanowski et al.
patent: 6573610 (2003-06-01), Tsai
patent: 6700204 (2004-03-01), Huang et al.
patent: 6871392 (2005-03-01), Tsuchiya et al.
patent: 2003-347356 (2003-12-01), None
patent: 2004-47781 (2004-02-01), None

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