Electronic-circuit assembly and its manufacturing method

Details Electronic-circuit assembly and its manufacturing method Electronic-circuit assembly and its manufacturing method

1997-03-13

1999-04-06

Feild, Lynn D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361705, 361707, 361718, 361719, 361749, 257700, 257706, 257707, 165 802, 165 803, H05K 720

Patent

active

058926577

ABSTRACT:
An electronic-circuit assembly of the present invention comprises a plurality of film carriers which are stacked. Respective film carriers have a plurality of through-holes. One of through-holes is provided on corresponding position to another through-hole in the stacked direction of the substrate. Two of adjacent film carriers are connected by the corresponding through-holes. A connection member is provided in two of adjacent through-holes in the stacked direction of the substrates. A connection state between film carriers can be easily checked. Since it is visually checked that solder appears inside the topmost through-hole. Furthermore, wiring lengths for connection between substrates can be reduced. Since the plurality of substrates are three-dimensionally connected.

REFERENCES:
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5384955 (1995-01-01), Booth et al.
Akihiro et al., "Packaging Technology for the NEC SX-3/SX-X Supercomputer", Proceedings of the Electronic Components and Technology Conference, Las Vegas, May 20-23, 1990, vol. 1, pp. 525-533.
Tummala et al., Microelectronics Packaging Handbook, 1989, pp. 462-464.

Affiliated with

Also associated with

Rating

Electronic-circuit assembly and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic-circuit assembly and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic-circuit assembly and its manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1376592