Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
1998-03-26
2001-03-27
Potter, Roy (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S697000, C257S774000
Reexamination Certificate
active
06208022
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to an electronic-circuit assembly and the manufacturing method thereof, particularly, to an electronic-circuit assembly and the manufacturing method thereof including a substrate upon which an electronic device is provided and other substrate which the former substrate is mounted.
An example of a conventional electronic-circuit assembly is disclosed in U.S. Pat. No. 5,203,075. The electronic-circuit assembly shown in
FIG. 10
of the reference has a substrate
13
upon which a flexible substrate
31
is mounted. The flexible substrate
31
is connected by solder to the substrate
13
. Specifically, the through-hole on the flexible substrate
31
is connected by solder to the pad on the substrate
13
. In order to make the flexible substrate
31
and the substrate
13
parallel, a frame
47
is set in the peripheral portion between the flexible substrate
31
and the substrate
13
. An LSI device
3
is provided on the flexible substrate
31
. Nothing other than both of the solder and the frame
47
is provided between the flexible substrate
31
and the substrate
13
.
The aforementioned conventional technology is faced with a problem that the flexible substrate may be poorly connected to the other substrate via solder. This problem is due to the flexible substrate not maintaining level, when or after the flexible substrate is mounted on the other substrate. Furthermore, the interval between the flexible substrate and the other substrate may not be kept even.
In addition, in the aforementioned conventional technology, there is also the problem that the device assembly is week to mechanical stresses or stress applied by the heat. The solder may come off causing breaking of the wire connections. These problems stem from the fact that the flexible substrate is only connected by solder to the other substrate.
Moreover, in the conventional technology, there is the problem that the device assembly is week to moisture. The solder which connections the flexible substrate to the other substrate may easily become weak, since the solder is exposed to a moist atmosphere. That is due to the fact that the solder connecting the flexible substrate to the other substrate is directly exposed to the open air. Moreover, there is also the possibility that a moist atmosphere causes migration to occur more easily.
SUMMARY OF THE INVENTION
Accordingly, the objective of the present invention is to provide an electronic-circuit assembly with a more reliable connection of a flexible substrate and the other substrate.
Another objective of the present invention is to provide an electronic-circuit assembly which can allow the space between a flexible substrate and other substrate to be at a fixed interval.
Anther objective of the present invention is to provide an electronic-circuit assembly in which the connections of the flexible substrate and other substrate can be made using other connecting materials, as well as solder.
Another objective of the present invention is to provide an electronic-circuit assembly in which the solder connection is of a flexible substrate providing difficulty for the other substrate to be exposed to the open air.
According to an aspect of the present invention, there is provided an electronic-circuit assembly which comprises a first substrate having a plurality of terminals which provided on the upper surface of said first substrate, a second substrate being provided on said first substrate, and having a plurality of through-holes which is provided on the positions opposing to said plurality of terminals, respectively, a plurality of connecting members for connecting each of said terminals on said first substrate to each of said through-holes of said second substrate, respectively, a plate provided on the upper surface of said second substrate, and a plurality of pins each inserted into each of said through-holes of said second substrate.
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NEC Corporation
Potter Roy
Sughrue Mion Zinn Macpeak & Seas, PLLC
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