Electronic circuit arrangement

Details Electronic circuit arrangement Electronic circuit arrangement

1992-10-05

1994-10-18

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361749, H05K 720

Patent

active

053574010

ABSTRACT:
An electronic circuit mounting arrangement includes heat-conducting, electrically insulating and/or conducting pastes (14, 30) as well as flexible conductor plates (16, 28). The utilization and application of these elements make it possible to increase the packing density of the components (22, 32) also in the field of the high-power circuit arrangements. It further provides for a substantial rationalization in the connection technique for an optimization in the means of the contacting procedure. The economic manufacturing, accompanied by a destruction-free partial demountability, permits based on the use of pastes and foils the further mounting of electronic circuit arrangements resulting in an increased circuit density in one circuit unit.

REFERENCES:
patent: 3952231 (1976-04-01), Davidson et al.
patent: 4180828 (1979-12-01), Schermer et al.
patent: 4858073 (1989-08-01), Gregory
Patent Abstracts of Japan JP-A-30 58 436 (No known date).
IBM Technical Disclosure Bulletin, Band 25, No: 10, Mar. 1, 1983.
IEEE Transactions, Band 13, No: 4, Dec. 1, 1990.

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