Electronic circuit apparatus

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361388, 361395, 361398, 361399, H05K 720

Patent

active

048580716

ABSTRACT:
A flexible printed circuit substrate is bent in a flattened rectangular C-shape and electronic parts generating heat are mounted on the inner surface of a central portion of the C-shaped substrate. Then a radiating heat-sink plate is adhered on the outer surface of that central portion. Temperature-sensitive electronic parts are mounted on one end portion of the C-shaped substrate and parts consisting of a power supply circuit are mounted on the other end portion. Then the entire assembly is accommodated in a housing having a connector.

REFERENCES:
patent: 3971127 (1976-07-01), Giguere et al.
patent: 4104701 (1978-08-01), Baranowski
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4547834 (1985-10-01), Dumont et al.
Kerjilian, "High Density Memory Package", IBM Technical Disclosure Bulletin, vol. 27, No. 4B, Sep. 1984, p. 2642.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic circuit apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-126773

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.