Electronic circuit and method of production thereof

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

29843, 29860, 361406, H05K 702

Patent

active

049673130

ABSTRACT:
An electronic circuit with flip-chip mounting of a semiconductor chip (5) on a substrate (1), wherein there is provided between the semiconductor chip (5) and the conductor tracks (2) of the substrate (1) a metallic solder stop layer (3) which is insulated from its environment by an oxide layer (4). With this type of solder stop layer, it is possible to obtain layer thickness which can be exactly reproduced, as a result of which a reliable flip-chip soldering is achieved.

REFERENCES:
patent: 4339785 (1982-07-01), Oshawa
patent: 4349860 (1982-09-01), Oshawa

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