Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-01-18
2011-01-18
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S710000
Reexamination Certificate
active
07872869
ABSTRACT:
Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.
REFERENCES:
patent: 4885126 (1989-12-01), Polonio
patent: 5471366 (1995-11-01), Ozawa
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 5710459 (1998-01-01), Teng et al.
patent: 5783862 (1998-07-01), Deeney
patent: 6477052 (2002-11-01), Barcley
patent: 6625028 (2003-09-01), Dove et al.
patent: 6696643 (2004-02-01), Takano
patent: 2003/0230799 (2003-12-01), Yee et al.
patent: 10-1995-0000960 (1995-02-01), None
patent: 10-2003-0035375 (2003-05-01), None
Lee Tae Soo
Park Yun Hwi
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
Thompson Gregory D
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