Electronic chip module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S710000

Reexamination Certificate

active

07872869

ABSTRACT:
Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.

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patent: 5471366 (1995-11-01), Ozawa
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 5710459 (1998-01-01), Teng et al.
patent: 5783862 (1998-07-01), Deeney
patent: 6477052 (2002-11-01), Barcley
patent: 6625028 (2003-09-01), Dove et al.
patent: 6696643 (2004-02-01), Takano
patent: 2003/0230799 (2003-12-01), Yee et al.
patent: 10-1995-0000960 (1995-02-01), None
patent: 10-2003-0035375 (2003-05-01), None

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