Electronic chip component with passivation film and organic prot

Details Electronic chip component with passivation film and organic prot Electronic chip component with passivation film and organic prot

1996-08-27

1997-07-08

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

257642, 257643, 257649, H01L 2358

Patent

active

056464398

ABSTRACT:
An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the wafer, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. A package for packing the component includes a carrier tape having therethrough a space for receiving the component with one end or side of the space opened, and a cover tape for closing the open end of the space after the component is stored in the space. A method for packing the component includes the steps of storing the component in the space of the carrier tape with one end of the space opened, and closing the open end of the space with the cover tape.

REFERENCES:
patent: 4523372 (1985-06-01), Balda et al.
patent: 4652598 (1987-03-01), Edelman
patent: 4901133 (1990-02-01), Curran et al.
patent: 4907064 (1990-03-01), Yamazaki et al.
patent: 4913930 (1990-04-01), Getson
patent: 4963405 (1990-10-01), Yamashita et al.

Affiliated with

Also associated with

Rating

Electronic chip component with passivation film and organic prot does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic chip component with passivation film and organic prot, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic chip component with passivation film and organic prot will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2410182