Electronic chip-carrier heat sinks

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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174 16HS, 439487, H05K 720

Patent

active

046791183

ABSTRACT:
Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both mechanically holds the package securely mated with a multi-pin socket and also cools the package by way of an integrated array of heat-radiating elements; edge clasping of the cap with a chip-carrying socket avoids interference with needed conduction of heat away from central areas of the package and cap.

REFERENCES:
patent: 3495131 (1970-02-01), Melcher
patent: 3670215 (1972-06-01), Wilkens
patent: 3904262 (1975-09-01), Cutchaw
patent: 4235285 (1980-11-01), Johnson
IBM Tech. Discl. Bull., vol. 10, No. 8, Jan. 1968, p. 1242, "Snap-On Heat Exchanger", Milligan.

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