Electronic carrier devices and methods of manufacture

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428328, 428901, 174 685, 361397, B32B 300, B32B 516, H05K 100, H05K 118

Patent

active

047599707

ABSTRACT:
New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.

REFERENCES:
patent: 3992212 (1976-11-01), Youtsey et al.
patent: 4048356 (1977-09-01), Bakos et al.
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4152477 (1979-05-01), Harvta et al.

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