Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-01-16
2009-08-11
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S768000, C361S808000, C174S534000, C174S535000
Reexamination Certificate
active
07573722
ABSTRACT:
An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a fourth sidewall of each of the two bond pads. The first sidewall and the fourth sidewall are both perpendicular to an alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the fourth sidewall of the at least one bond pad and a corresponding side of the corresponding opening.
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Huang Chih-Ming
Tsai Fang-Lin
Tsai Ho-Yi
Tseng Wen-Tsung
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Nguyen Hoa C
Reichard Dean A.
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