Registers – Records
Reexamination Certificate
2005-06-14
2005-06-14
Lee, Diane I. (Department: 2876)
Registers
Records
Reexamination Certificate
active
06905073
ABSTRACT:
An electronic card and the shell for the electronic card capable of exceeding applicable bending, torque, and fingernail test specifications are disclosed. The electronic card assembly can resist a bend of greater than 10° during a torque test applying a torque of greater than approximately 1.2 N-m; deflects less than approximately 3.5 mm during a PCMCIA bend test applying a force of approximately 20N; and displaces less than approximately 1.5 mm during a fingernail test applying a force of more than approximately 100N. Such test performance is achieved even without a printed circuit board in the electronic card assembly.
REFERENCES:
patent: 4872848 (1989-10-01), Mouissie
patent: 5144533 (1992-09-01), Annett
patent: 5207586 (1993-05-01), MacGregor
patent: 5330360 (1994-07-01), Marsh et al.
patent: 5339222 (1994-08-01), Ramey et al.
patent: 5377060 (1994-12-01), Nigam
patent: 5409385 (1995-04-01), Tan et al.
patent: 5463531 (1995-10-01), Choon et al.
patent: 5476387 (1995-12-01), Ramey et al.
patent: 5477426 (1995-12-01), Bethurum
patent: 5478259 (1995-12-01), Noschese
patent: 5493477 (1996-02-01), Hirai
patent: 5497297 (1996-03-01), Kilmer et al.
patent: 5502892 (1996-04-01), Lien
patent: 5529503 (1996-06-01), Kerklaan
patent: 5536905 (1996-07-01), Redman et al.
patent: 5548483 (1996-08-01), Feldman
patent: 5563770 (1996-10-01), Bethurum
patent: 5564948 (1996-10-01), Harting et al.
patent: 5567884 (1996-10-01), Dickinson et al.
patent: 5574628 (1996-11-01), Persia et al.
patent: 5687064 (1997-11-01), Nichols
patent: 5689405 (1997-11-01), Bethurum
patent: 5736646 (1998-04-01), Dickinson et al.
patent: 5754404 (1998-05-01), Biermann et al.
patent: 5768110 (1998-06-01), Frommer et al.
patent: 5833473 (1998-11-01), Betker et al.
patent: 5984731 (1999-11-01), Laity
patent: 6058018 (2000-05-01), Gerrits et al.
patent: 6116962 (2000-09-01), Laity
patent: 6160711 (2000-12-01), Gerrits et al.
patent: 4-63284 (1992-05-01), None
Keizou Sakurai, Electronic Manufacturing Technology Symposium, 1995, [The basic processing parameters and reliability evaluation results for the new IC-Card packaging method by using transfer molding].
Ed Marsh, IEEE Technical Applications Conference and Workshops Northcon95, Oct. 1995 [Packaging Guidelines for PC Cards].
Gerrits Antonius H. J.
Pigmans Paulus J.
Potters Paul J. M.
Van Alst Wim
FCI Americas Technology Inc.
Lee Diane I.
Woodcock & Washburn LLP
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