Electronic assembly with semi-crystalline copolymer adhesive

Details Electronic assembly with semi-crystalline copolymer adhesive Electronic assembly with semi-crystalline copolymer adhesive

1995-12-21

1997-09-30

Ryan, Patrick

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

428209, 428901, 361748, 361750, 361762, B32B 900

Patent

active

056724004

ABSTRACT:
The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition, preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern on a first substrate to a second circuit pattern on a second substrate. The adhesive composition preferably includes a semi-crystalline copolymer comprising polyether and polyamide monomeric units, a tackifier, and conductive particles.

REFERENCES:
patent: 4698242 (1987-10-01), Salerno
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5143785 (1992-09-01), Pujol et al.
patent: 5334430 (1994-08-01), Ishikawa
"PEBAX" Brochure, Atochem S.A., Dec. 1987.
"PEBAX 3533 SA 00" Brochure, Atochem S.A., Apr. 1988.
"Fluxless Flip Chip Bonding on Flexible Substrates: A Comparison Between Adhesive Bonding and Soldering," Aschenbrenner et al., Fraunhofer-Institut for Zuverlassigkeit und Mikrointegration (IZM), pp. 91-101, 1994.
"Viscoelastic Properties of Polymers," Ferry, Second Edition, Chapter 2, pp. 40-51, John Wiley & Sons, Inc., 1970.
"Investigations into the Use of Adhesives for Level-1 Microelectronic Interconnections," Hogerton et al., Mat. Res. Soc. Symp. Proc., vol. 154, 1989 Materials Research Society, pp. 415-424.

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