Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2007-07-17
2007-07-17
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257S783000, C257S690000, C257S724000, C257SE23023
Reexamination Certificate
active
11040726
ABSTRACT:
An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of the substrate includes a plurality of conductive traces formed thereon. The plurality of conductive traces includes a first conductive trace and a second conductive trace. The electronic component is electrically coupled between the first and second conductive traces. A component body of the electronic component is subject to interaction with a flux, which is utilized during electrical coupling of the electronic component to the first and second conductive traces, to form a current leakage path. The substrate is configured to prevent the formation of the current leakage path.
REFERENCES:
patent: 5001829 (1991-03-01), Schelhorn
patent: 5684677 (1997-11-01), Uchida et al.
patent: 6049466 (2000-04-01), Jairazbhoy
patent: 2002/0053589 (2002-05-01), Owen et al.
patent: 2003/0006503 (2003-01-01), Yoneda et al.
patent: 2005/0061107 (2005-03-01), Hampden-Smith et al.
Anton Raymond B.
Duff Brentt C.
Harshbarger Daniel R.
Kuhlman Frederick F.
Pepples Michael J.
Delphi Technologies Inc.
Funke Jimmy L.
Parekh Nitin
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