Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-01-27
1998-12-08
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165907, 361708, H05K 720
Patent
active
058479279
ABSTRACT:
An electronic substrate is formed of a porous planar heat exchanger and an orifice plate overlying and thermally contacting the heat exchanger. The orifice plate has a plurality of apertures therethrough. An electronic device is mounted to the orifice plate. A coolant such as air or other gas is forced through the heat exchanger and the apertures of the orifice plate to remove heat that is generated by the electronic device. Preferably, at least two of the assemblies formed of the substrate and the mounted electronic device are mounted in a facing relationship to form a multichip module. A housing is provided to support the assemblies and to channel the flow of coolant through the substrates. Electrical interconnection between the components is provided by a peripheral ring with electrically conducting paths therethrough, which ring extends between the facing substrates.
REFERENCES:
patent: 5224030 (1993-06-01), Banks
patent: 5251099 (1993-10-01), Goss
patent: 5297006 (1994-03-01), Muzikoshi
patent: 5322116 (1994-06-01), Galloway
patent: 5495126 (1996-02-01), Iguchi
patent: 5561321 (1996-10-01), Hirano
patent: 5699234 (1997-12-01), Saia
Minning Charles P.
Schroeder John H.
Wolfe Douglas W.
Alkov Leonard A.
Lenzen, Jr. Glenn H.
Raufer Colin M.
Raytheon Company
Tolin Gerald P.
LandOfFree
Electronic assembly with porous heat exchanger and orifice plate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic assembly with porous heat exchanger and orifice plate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assembly with porous heat exchanger and orifice plate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-184389