Electronic assembly with integrated IO and power contacts

Details Electronic assembly with integrated IO and power contacts Electronic assembly with integrated IO and power contacts

2006-03-20

2008-03-18

Potter, Roy Karl (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S111000

Reexamination Certificate

active

07344918

ABSTRACT:
In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.

REFERENCES:
patent: 5969415 (1999-10-01), Prancz
patent: 6200830 (2001-03-01), Ito et al.
patent: 6597063 (2003-07-01), Shimizu et al.
patent: 2005/0051889 (2005-03-01), Wood et al.
patent: 2005/0212120 (2005-09-01), Tran

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