Electronic assembly with improved grounding and EMI shielding

Details Electronic assembly with improved grounding and EMI shielding Electronic assembly with improved grounding and EMI shielding

1993-04-29

1994-05-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 35R, 174 35C, 174 51, 361728, 361752, 361753, 361799, 361800, 361816, 439108, 439109, 439609, H05K 900

Patent

active

053114086

ABSTRACT:
An electronic assembly includes an electronic module mountable to a backplane having a ground plane for grounding and EMI shielding. The electronic module includes a conductive chassis having a floating chassis board. Interface connectors are mounted to the chassis board and to the backplane and mate with one another when the electronic module engages the backplane. A grounding clip is mounted to the chassis board and is used to engage an alignment pin extending from the backplane. The grounding clip includes a laterally extending resilient arm which grounds the clip to the chassis. The alignment pin is electrically connected to the backplane ground plane and the grounding clip is electrically connected to the chassis board ground plane so that both ground planes are grounded to the chassis through the grounding clip. The backplane includes a ground pad which circumscribes the interface connectors and is connected to the ground plane. A conductive gasket mechanically and electrically couples the chassis with the ground pad so that the chassis, conductive gasket, ground pad and ground plane provide an effective EMI shield surrounding the interface connectors.

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