Electronic assembly with enhanced heat sinking

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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165 803, 165185, 174 163, 357 81, 361383, 361398, H05K 720

Patent

active

050034294

ABSTRACT:
An electronic package which includes at least two flexible circuitized substrates (e.g., thin film elements) connected at one location to a common first circuitized substrate (e.g., printed circuit board) and at another location to a semiconductor device, these subassemblies being located within a base member of the package. In one embodiment, a singular heat sink member is thermally coupled to a respective one of the semiconductor devices, and a common, second heat sink member is thermally coupled to all of the first heat sink members. This common heat sink member also uniquely serves as a stiffener for the package. In another embodiment, a common heat sink member is securedly positioned on the opposite side of a first circuitized substrate from the plurality of flexible circuitized substrates and semiconductor devices. A base member is also used as part of this package. As in the aforementioned other embodiment, the common heat sink member also serves as a stiffener.

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IBM TDB, vol. 24, No. 1A (06/81), D. T. Conn et al.

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