Electronic assembly with a heat sink, in particular for the high

Details Electronic assembly with a heat sink, in particular for the high Electronic assembly with a heat sink, in particular for the high

1996-12-11

1998-08-25

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 361719, 361720, H05K 720

Patent

active

057989087

ABSTRACT:
An electronic assembly comprising a heat sink and a double-sided printed circuit card assembled to the heat sink by hot pressing. The card carries a plurality of surface-mounting components on its face remote from the heat sink. Further, the card carries at least one through component and the heat sink has a void over the zone of the printed circuit card which receives the through component. The ends of the pins of the component are bonded to the card inside the void.

REFERENCES:
patent: 4974119 (1990-11-01), Martin
patent: 4979074 (1990-12-01), Murley et al.
patent: 5196990 (1993-03-01), Kurosaki
patent: 5276584 (1994-01-01), Collins et al.
patent: 5523919 (1996-06-01), Canova
patent: 5703752 (1997-12-01), Woo

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