Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-12-05
2006-12-05
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S028000, C438S029000, C438S034000, C438S122000, C257SE51019, C257SE51021, C257SE51022, C257SE33056, C257SE33058, C257SE33062, C257SE33066, C257SE33067, C257SE33068, C257SE33070, C257SE33075
Reexamination Certificate
active
07144748
ABSTRACT:
An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during diode operation, and the array configured for passing coolant fluid for transfer of heat to the fluid. LED packages adjustable relative to a mounting grid, are also provided.
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Graybill David E.
Haefliger William W.
OnScreen Technologies
LandOfFree
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