Electronic assembly process and apparatus

Details Electronic assembly process and apparatus Electronic assembly process and apparatus

1981-04-29

1983-02-08

Ramsey, Kenneth J.

Metal fusion bonding

Process

With shaping

228180R, 228212, 53140, 361402, H05K 334

Patent

active

043724752

ABSTRACT:
A system of composition, apparatuses and process provides for a rapid and reliable development and location of a web fabric structure to position and hold each member of a closely spaced assembly of positioned but not electrically connected units comprising discrete electrical components and integrated circuits in place on a printed circuit board with the external leads or connectors of such units projecting through holes in such circuit board so that such units are held to the circuit board during soldering of those leads to the conductive portions of the printed circuit board and other manipulations. The fabric structure and a coacting masking agent are of such chemical composition that they are readily completely removed from the circuit board and from the units after need for such fabric and masking agent has passed.

REFERENCES:
patent: 2687363 (1954-08-01), Manning
patent: 3388465 (1965-03-01), Johnston
patent: 3610811 (1971-10-01), O'Keefe
patent: 4283480 (1981-08-01), Davies et al.
IBM Technical Disclosure Bulletin, vol. 16, No. 6, Nov. 1973, p. 1749.

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