Electronic assembly including a die having an integrated...

Details Electronic assembly including a die having an integrated... Electronic assembly including a die having an integrated...

2005-07-26

2005-07-26

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S113000

Reexamination Certificate

active

06921706

ABSTRACT:
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

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Liu et al., “Diamond Chemical Vapor Deposition: Nucleation and Early Growth Stages”, 1995, pp. 1-7.
Wolf, Stanley et al. Silicon Processing for the VLSI Era—vol. 1, 1986, pp. 1-8.

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