Electronic assembly having enhanced heat dissipating capabilitie

Details Electronic assembly having enhanced heat dissipating capabilitie Electronic assembly having enhanced heat dissipating capabilitie

1989-11-03

1991-05-28

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 163, 357 81, 361388, 361400, 361403, H05K 720

Patent

active

050199412

ABSTRACT:
Heat removal is accomplished by utilizing a first metal conductive pad to conduct the heat from an electrical component. The first pad is juxtaposed and thereby thermally coupled by convection to one or more ground pads having plated through holes to a ground plane and heat sink.

REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 4739448 (1988-04-01), Rowe et al.
Tiffany, "Integrated Circuit Package and Heat Sink", IBM Technical Disclosure Bulletin, vol. 13, No. 7, Jun. 1970, p. 58.
Goldman, "Heat Dissipative Chip Carriers", IBM Technical Disclosure Bulletin, vol. 14, No. 12, May 1972, p. 3850.

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