Electronic assembly having a substrate laminated within a...

Details Electronic assembly having a substrate laminated within a... Electronic assembly having a substrate laminated within a...

2005-01-27

2008-08-26

Sells, James (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S580000

Reexamination Certificate

active

07416011

ABSTRACT:
An electronic assembly includes a backplate, a substrate and a pressure sensitive adhesive (PSA). The backplate includes a cavity and the substrate includes a plurality of interconnected electrical components. The substrate is positioned within the cavity and a wall height of the cavity is greater than a combined thickness of the substrate and the adhesive, which bonds the substrate to the backplate.

REFERENCES:
patent: 5494546 (1996-02-01), Horvath
patent: 19625756 (1998-01-01), None
patent: 10102848 (2002-01-01), None
patent: 2659344 (1991-09-01), None
patent: 2733656 (1996-10-01), None
patent: 1561685 (1980-02-01), None
EP Search Report dated Jan. 8, 2008.

Affiliated with

Also associated with

Rating

Electronic assembly having a substrate laminated within a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic assembly having a substrate laminated within a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assembly having a substrate laminated within a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3994006