Electronic assembly having a socket with features that...

Details Electronic assembly having a socket with features that... Electronic assembly having a socket with features that...

2005-02-01

2005-02-01

Hyeon, Hae Moon (Department: 2839)

Electrical connectors

Aligning means for dual inline package

C439S070000

Reexamination Certificate

active

06848936

ABSTRACT:
An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.

REFERENCES:
patent: 5066245 (1991-11-01), Walker
patent: 5713744 (1998-02-01), Laub
patent: 6071139 (2000-06-01), Corisis et al.
patent: 6132220 (2000-10-01), McHugh et al.
patent: 6164980 (2000-12-01), Goodwin
patent: 6534856 (2003-03-01), Dozier et al.
patent: 6669489 (2003-12-01), Dozier et al.

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