Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-05-31
2005-05-31
Gushi, Ross (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06899549
ABSTRACT:
An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.
REFERENCES:
patent: 6016254 (2000-01-01), Pfaff
patent: 6179624 (2001-01-01), McHugh et al.
patent: 6547583 (2003-04-01), Ma et al.
Blakely , Sokoloff, Taylor & Zafman LLP
Gushi Ross
LandOfFree
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