Electronic assembly having a double-sided leadless component

Details Electronic assembly having a double-sided leadless component Electronic assembly having a double-sided leadless component

1993-12-23

1995-06-20

Picard, Lea P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257738, 257780, H01L 2302

Patent

active

054262631

ABSTRACT:
An electronic assembly has a double-sided leadless component (10) and one or more printed circuit boards (30, 32). The component has a plurality of electrical terminations or pads (18) on both opposing major surfaces. Each of the printed circuit boards has a printed circuit pattern that has a plurality of pads (34, 36) that correspond to the electrical terminations on both sides of the double-sided leadless component. The electrical terminals on one side of the component are attached to the pads on the first substrate and the electrical terminals on the other side of the leadless component are attached to the pads on the second substrate. The printed circuit boards are joined together to form a multilayered circuit board (44) so that the double-sided leadless component is buried or recessed inside. The component is attached to the pads of the printed circuit board using solder.

REFERENCES:
patent: 4682207 (1987-07-01), Akasaki et al.
patent: 4688150 (1987-08-01), Peterson
patent: 5166773 (1992-11-01), Temple et al.
patent: 5166866 (1992-11-01), Kim et al.
patent: 5219794 (1993-06-01), Satoh
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5313366 (1994-05-01), Gaudenzi et al.
patent: 5327325 (1994-07-01), Nilewakner, Jr.

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