Electronic assembly for removing heat from a semiconductor devic

Details Electronic assembly for removing heat from a semiconductor devic Electronic assembly for removing heat from a semiconductor devic

1999-12-07

2000-11-28

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 361704, H05K 720

Patent

active

061543691

ABSTRACT:
An electronic assembly (20) having an insulated metal heat sink (10) and a method of manufacturing the electronic assembly (20). The electronic assembly (20) has a heat dissipater (11), a dielectric material (12), and a conductive layer (13). A semiconductor chip (21) is attached to the insulated metal heat sink (10). Heat generated by the semiconductor chip (21) is conducted to the conduction surface (14) of the heat dissipater (11). In one embodiment a convection surface (16) of the heat dissipater (11) is present and the heat is transferred from the convection surface (16) of the heat dissipater (11) to a fluid by convection. The fluid is directed by a manifold (64).

REFERENCES:
patent: 5218516 (1993-06-01), Collins
patent: 5436793 (1995-07-01), Sanwo
patent: 5455458 (1995-10-01), Quon
patent: 5475565 (1995-12-01), Bhattacharyya
patent: 5504378 (1996-04-01), Lindberg
patent: 5513072 (1996-04-01), Imaji
patent: 5625536 (1997-04-01), Soyano
patent: 5657203 (1997-08-01), Hirao
patent: 5666269 (1997-09-01), Romero
patent: 5751552 (1998-05-01), Scanlan
patent: 5926373 (1999-07-01), Stevens

Affiliated with

Also associated with

Rating

Electronic assembly for removing heat from a semiconductor devic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic assembly for removing heat from a semiconductor devic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assembly for removing heat from a semiconductor devic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1732065