Electronic assembly comprising solderable thermal interface...

Details Electronic assembly comprising solderable thermal interface... Electronic assembly comprising solderable thermal interface...

2006-08-15

2006-08-15

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S106000, C438S119000, C438S121000, C438S122000, C438S612000, C438S613000

Reexamination Certificate

active

07091063

ABSTRACT:
To accommodate high power densities associated with high performance integrated circuits, heat is dissipated from a surface of a die through a solderable thermal interface to a lid or integrated heat spreader. In one embodiment, the die is mounted on an organic substrate using a C4 and land grid array arrangement. In order to maximize thermal dissipation from the die while minimizing warpage of the package when subjected to heat, due to the difference in thermal coefficients of expansion between the die and the organic substrate, a thermal interface is used that has a relatively low melting point in addition to a relatively high thermal conductivity. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.

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