Electronic assembly and a method of constructing an...

Details Electronic assembly and a method of constructing an... Electronic assembly and a method of constructing an...

2006-02-14

2006-02-14

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S842000, C228S180210, C438S613000

Reexamination Certificate

active

06996899

ABSTRACT:
Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.

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