Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2001-09-13
2004-05-04
Cuneo, Kamand (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000, C174S261000, C174S266000, C361S760000, C361S777000, C361S794000, C257S778000, C257S738000
Reexamination Certificate
active
06730860
ABSTRACT:
BACKGROUND OF THE INVENTION
1). Field of the Invention
This invention relates generally to an electronic assembly, typically of the kind having a package substrate secured to a printed circuit board utilizing solder bumps.
2). Discussion of Related Art
Integrated circuits are often manufactured in and on semiconductor wafers which are subsequently cut into individual semiconductor chips. A chip is then mounted to a package substrate and electrically connected thereto. The package substrate is then mounted to a printed circuit board.
Solder balls are usually located on the surface of the package substrate which is located against the printed circuit board. The combination is then heated and allowed to cool so that the solder balls form solder bumps which secure the package substrate structurally to the printed circuit board, in addition to electrically connecting the package substrate to the printed circuit board.
Electronic signals can be provided through the solder bumps between the printed circuit board and the integrated circuit. Other ones of the solder bumps provide power and ground to the integrated circuit. It may occur that high currents flow through some of the solder bumps, in particular those providing power or ground to the integrated circuit. These high currents may cause damage to the solder bumps. The solder bumps providing power, ground and signal communication are also usually equally spaced from one another thus taking up similar amounts of space.
REFERENCES:
patent: 4861941 (1989-08-01), Kubo et al.
patent: 5088007 (1992-02-01), Missele
patent: 5686699 (1997-11-01), Chu et al.
patent: 5786630 (1998-07-01), Bhansali et al.
patent: 5842877 (1998-12-01), Mångrtensson et al.
patent: 5847936 (1998-12-01), Forehand et al.
patent: 5973929 (1999-10-01), Arakawa et al.
patent: 6064113 (2000-05-01), Kirkman
patent: 6191475 (2001-02-01), Skinner et al.
patent: 6198635 (2001-03-01), Shenoy et al.
patent: 6346679 (2002-02-01), Nakamura
patent: 6388890 (2002-05-01), Kwong et al.
patent: 6448639 (2002-09-01), Ma
patent: 6449169 (2002-09-01), Ho et al.
patent: 6479758 (2002-11-01), Arima et al.
patent: 197 48 689 (1999-05-01), None
patent: 2 358 735 (2001-08-01), None
patent: 08236 655 (1996-09-01), None
patent: 08288 626 (1996-11-01), None
patent: 10056 093 (1998-02-01), None
Dishongh Terrance J.
Jackson James D.
Searls Damion T.
Blakely , Sokoloff, Taylor & Zafman LLP
Cuneo Kamand
LandOfFree
Electronic assembly and a method of constructing an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic assembly and a method of constructing an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assembly and a method of constructing an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3234287