Electronic assembly

Details Electronic assembly Electronic assembly

1999-08-23

2000-08-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361816, 361760, 361767, 361783, 361820, 174 35R, 174 522, 174 524, 257659, 257660, 257734, 257737, 257738, 257780, 257781, 257782, H05K 900

Patent

active

061117617

ABSTRACT:
An electronic assembly (1) having at least one semiconductor die (2) with external electrodes (3) has a foldable electrically insulating substrate (4) supporting a plurality of conductive leads (5) connected and mounted to respective ones of the electrodes (3). A plurality of external connectors (11) supported by the substrate (4) are electrically coupled to respective ones of the leads (5). The substrate (4) is folded at least once into a folded position to form at least two opposite facing surfaces (8, 9) with an adhesive and the die (2) at least partially sandwiched therebetween. The adhesive bonding the substrate (4) to the die (2) maintains the substrate (4) in the folded position.

REFERENCES:
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5406027 (1995-04-01), Matsumoto et al.
patent: 5666008 (1997-09-01), Tomita et al.
patent: 5910641 (1999-06-01), Gaynes et al.

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