Electronic assemblies without solder and methods for their...

Details Electronic assemblies without solder and methods for their... Electronic assemblies without solder and methods for their...

2011-07-19

2011-07-19

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S455000, C438S125000, C257S687000, C257S668000

Reexamination Certificate

active

07981703

ABSTRACT:
The present invention provides an electronic assembly400and a method for its manufacture800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly400uses no solder. Components406, or component packages402, 802, 804, 806with I/O leads412are placed800onto a planar substrate808. The assembly is encapsulated900with electrically insulating material908with vias420, 1002formed or drilled1000through the substrate808to the components' leads412. Then the assembly is plated1200and the encapsulation and drilling process1500repeated to build up desired layers422, 1502, 1702. Assemblies may be mated1800. Within the mated assemblies, items may be inserted including pins2202a,2202b, and2202c, mezzanine interconnection devices2204, heat spreaders2402, and combination heat spreaders and heat sinks2602. Edge card connectors2802may be attached to the mated assemblies.

REFERENCES:
patent: 4591220 (1986-05-01), Impey
patent: 5793115 (1998-08-01), Zavracky et al.
patent: 5873161 (1999-02-01), Chen et al.
patent: 6204089 (2001-03-01), Wang
patent: 7276786 (2007-10-01), Cho et al.
patent: 7301228 (2007-11-01), Usui et al.
patent: 2004/0156173 (2004-08-01), Jeong
patent: 2006/0104035 (2006-05-01), Vasoya et al.

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