Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-18
2007-12-18
Duong, Hung Van (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S737000, C438S614000
Reexamination Certificate
active
11237678
ABSTRACT:
An electronic apparatus includes a package, a circuit board, a thermal dissipating module and a thermal transmitting module. The package includes a substrate, a heat source and a plurality of electric terminals electrically connected to the circuit board. The heat source and the electric terminals are disposed on a surface of the substrate facing to the circuit board. The heat source is located between the substrate and the circuit board. The thermal transmitting module passes through the electric connection structures between the package and the circuit board and connects the heat source of the package with the thermal dissipating module. Thus, the thermal transmitting module enhances the thermal dissipating efficiency for the heat source of the package and improves the reliability of the electronic apparatus.
REFERENCES:
patent: 5535526 (1996-07-01), White
patent: 6165885 (2000-12-01), Gaynes et al.
Lin Chung-An
Yang Chih-An
Duong Hung Van
VIA Technologies Inc.
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