Electronic apparatus with plug-in heat pipe module cooling syste

Details Electronic apparatus with plug-in heat pipe module cooling syste Electronic apparatus with plug-in heat pipe module cooling syste

1997-08-20

1999-11-09

Feild, Lynn D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361699, 361700, 16510433, 174 152, G06F 120, H05K 720

Patent

active

059826169

ABSTRACT:
A self-contained liquid cooled heat sink system disposed in a computer has a plurality of socket portions through which a cooling liquid is pumped. Operating heat from a plurality of heat-generating computer components, representatively circuit board-mounted processor chips, is efficiently transferred to the heat sink system by heat pipe modules associated with the heat-generating components. Each module includes (1) an evaporator plate held in thermal contact with its associated component, (2) a condenser plate removably plugged into one of the sockets and in a heat transfer relationship therewith, and (3) a plurality of thermosyphoning type heat pipes interconnected between the evaporator and condenser plates. The use of the heat pipe modules permits rapid and easy pull-away electrical and cooling system disconnection for each processor board as well as providing for effective cooling of the processors without the necessity of forcing a flow of air across them.

REFERENCES:
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patent: 5289342 (1994-02-01), Spalding et al.
patent: 5343358 (1994-08-01), Hilbrink
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patent: 5696405 (1997-12-01), Weld
patent: 5712762 (1998-01-01), Webb
patent: 5757615 (1998-05-01), Donahoe et al.
patent: 5764483 (1998-06-01), Ohashi et al.

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