Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-01-25
2005-01-25
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257S717000, C257S718000, C257S719000, C257S720000
Reexamination Certificate
active
06847113
ABSTRACT:
An electronic apparatus, including a plate-like member, enclosing a heat-accumulating material of latent heat type within an inside thereof; a semiconductor element, being connected with the member, thermally; and a housing covering the semiconductor element and the member. A surface of the member, in contact with the semiconductor element, is provided with recess-portions in plural numbers thereof, each being recessed in a direction of the heat-accumulating material of latent heat type, so as to enclose the heat-accumulating material of latent heat type into the recess portions. The plate-like member and the housing are connected with each other, thermally, thereby providing a cooling device, being able to cool the electronic circuit component(s) building up the electronic apparatus, as well as being superior in operability.
REFERENCES:
patent: 06-214067 (1994-08-01), None
Hirasawa Shigeki
Nakanishi Masato
Ohashi Shigeo
Antonelli Terry Stout & Kraus LLP
Flynn Nathan J.
Forde Remmon R.
Hitachi , Ltd.
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