Electronic apparatus with optional coupling

Details Electronic apparatus with optional coupling Electronic apparatus with optional coupling

1975-11-21

1977-03-01

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 65, 357 68, 357 69, 357 71, 174 52S, 361400, 361402, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

040104885

ABSTRACT:
In the manufacture of certain types of electronic devices, a plurality of leads are simultaneously bonded in side-by-side relation to a corresponding number of "active" bonding sites or pads on a substrate, the "active" pads being the ends of conductive paths on the substrate. Particularly narrow active bonding pads are used to minimize the possibility of shorting together adjacent pads by leads which are not properly aligned on centers with the pads. Electrically isolated "dummy" pads, comprising relatively small metallized areas are not connected to conductive paths, are provided on the substrate between each active pad. Portions of the misaligned leads extending beyond the edges of the active pads overlap and are bonded to the dummy pads, thus minimizing the loss of bonding strength otherwise caused by the misalignment of the leads with the active pads.

REFERENCES:
patent: 3262022 (1966-07-01), Caracciolo
patent: 3287610 (1966-11-01), Reber
patent: 3457639 (1969-07-01), Weller
patent: 3497947 (1970-03-01), Ardezzone
patent: 3546543 (1970-12-01), Hessinger
patent: 3627901 (1971-12-01), Happ
patent: 3893156 (1975-07-01), Riseman

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