Electricity: electrical systems and devices – Miscellaneous
Patent
1986-10-10
1988-01-12
Tolin, G. P.
Electricity: electrical systems and devices
Miscellaneous
361384, H05K 720, H02B 120
Patent
active
047195410
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The present invention relates to a mounting structure including a power supply structure between a power supply and an electronic apparatus such as printed wiring board and a cooling structure to be used for electronic apparatus such as a computer system, and particularly to a power supply structure which is so structured that the power is supplied through a bath plate having a plurality of conductive layers and a mounting structure which is suitable for air cooling by a fan.
An electronic apparatus such as electronic computer system is structured as shown in the side elevation of FIG. 3.
An electronic apparatus 5 is housed in an enclosure 1 which is provided with a door 2 to be opened or closed. Moreover, the housed electronic apparatus 5 is provided with a fan unit 7 and a duct 6 and the electronic apparatus 5 is cooled by air by driving the fan 8.
At the bottom part of enclosure 1, the legs 3 for supporting the enclosure 1 from the floor surface and the casters 4 for transferring the enclosure 1 along the floor surface are further provided.
Such recent electronic apparatus 5 is formed as a semiconductor element such as an LSI which assures high packing density and high speed operations, a one-board substrate on which an electronic circuit is formed by mounting circuit elements on a single multilayered printed wiring board, and a power supply which supplies specified power to said one board substrate.
In the case of such electronic apparatus, the power source supplied to the one board substrate from the power supply has a low drop of voltage through the bus because it is shortened as much as possible and it is also necessary that the cooling efficiency must be high because the one board substrate generates a large amount of heat.
Accordingly, it is generally important for such electronic apparatus that the structure thereof can be formed in compactly without causing any problem in the air cooling system.
The structure of electronic apparatus of prior art has been formed as indicated in the perspective view of FIG. 4.
A unit 10 formed using a one board substrate 19 engaged with the one or both surfaces of a bus plate 13 through the posts 14 and a power supply unit 18 provided with the output terminals 18A, 18B are arranged together. The bus plate 13 is composed of a conductive layer 11, which is provided with mounting holes 11A for mounting on an enclosure frame and is connected to the earth, and conductive layers 12 which are layered on both sides of conductive layer 11 in order to hold it through the insulation materials and are connected to the specified power source voltage.
Moreover, the posts 14 fixed respectively to the conductive layer 11 or conductive layer 12 of bus plate 13 are conductively connected to the predetermined land of the one board substrate 19 with a screw 15 screwed to the threaded hole provided at the end portion of post through the fitting hole of the one board substrate 19.
This post 14 is formed by a flexible conductive material and it should desirably to extensive and compressive. (For details, refer to the Japanese Patent Application No. 59-111280.)
Power supply bars 16, 17 are extended between the bus plate 13 and power supply unit 18, the conductive layer 11 is connected to the power supply bar 16 while the conductive layer 12 is connected to the power supply bar 17 respectively by screwing a bolt 21 to the bus plate 13. Moreover, the power supply bar 16 is connected to the output terminal 18A while the power supply bar 17 to the output terminal 18B respectively by screwing the bolts 20, and the power sources from the output terminals 18A, 18B of power supply unit 18 are supplied to the one board substrate 19 through the bus plate 13 and post 14.
Cooling can be done in such a way that the surface B of one board substrate 19 is cooled by ventilation in the direction of arrow mark D while the space A by ventilation in the direction of arrow mark C.
Such structure however has a problem that the power supply bus is longer and thereby the voltage dro
REFERENCES:
patent: 3125628 (1964-03-01), Fisher
patent: 4365288 (1982-12-01), Robe
patent: 4401844 (1983-08-01), Fleuret
Okumura Eichiro
Ono Izumi
Takahashi Yasuo
Takayama Haruo
Fujitsu Limited
Tolin G. P.
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