Electronic apparatus interconnect routing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S759000, C257S760000

Reexamination Certificate

active

07741718

ABSTRACT:
Apparatus are provided for routing interconnects of a dual-gate electronic device operating in a differential configuration. An electronic apparatus formed on a substrate is provided comprising a first interconnect (40, 42, 44) configured to couple to a first region of the substrate, a first gate (22, 24, 26, 28) coupled to the first interconnect and configured to receive a first differential input, a second interconnect (30, 32, 34, 36, 38) parallel to the first interconnect and configured to couple to a second region of the substrate, and a second gate (20) coupled to the second interconnect and configured to receive a second differential input. The first gate is parallel to the first interconnect, and the second gate is parallel to the second interconnect.

REFERENCES:
patent: 7170115 (2007-01-01), Tokunaga et al.
patent: 2004/0196110 (2004-10-01), Boccuzzi et al.
patent: 2004/0198013 (2004-10-01), Johansson
patent: 2004/0201045 (2004-10-01), Kurosawa et al.
patent: 2004/0203213 (2004-10-01), Chung
patent: 2004/0214383 (2004-10-01), Altman
patent: 2006/0091480 (2006-05-01), Desko et al.
patent: 2007/0034960 (2007-02-01), Zhang et al.
Van Zant, Peter, Microchip Fabrication, 2000, McGraw-Hill, 4th edition, pp. 386 and 387.

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