Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1998-09-16
2001-06-26
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C361S802000
Reexamination Certificate
active
06252775
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to an electronic apparatus having a printed circuit board module accommodated in a case thereof, the printed circuit board module having electronic elements, such as integrated circuit devices (hereinafter called “IC devices”), mounted thereon.
A conventional electronic apparatus of the foregoing type will now be described with reference to FIG.
1
. As shown in
FIG. 1
, a printed circuit board module
100
has a printed circuit board (hereinafter called a “resin-type printed circuit board”)
8
in the form of a resin plate having signal lines formed thereon. On the printed circuit board
8
, there are mounted electronic elements
3
, such as IC devices, resistors, capacitors by soldering or the like. Ends of the resin-type printed circuit board
8
are placed in joining portions
4
a
formed in a case
4
. Metal pressing members
5
are inserted between inner walls of the joining portions
4
a
and the ends of the resin-type printed circuit board
8
. Thus, the printed circuit board module
100
is fixed to the inside portion of the case
4
.
The resin-type printed circuit board
8
of the conventional electronic apparatus having the above-mentioned structure suffers from unsatisfactory thermal conductivity. Thus, heat generated by the electronic elements
3
, such as the IC devices, cannot easily effectively be relieved to the case
4
through the resin-type printed circuit board
8
. When the electronic elements
3
are the IC devices, the temperatures at junctions of the IC devices cannot be lowered. As a result, reliability of the operations of the IC devices deteriorates. Thus, reliability of the operations as the electronic apparatus excessively deteriorates.
An object of the present invention is to provide an electronic apparatus having a printed circuit board module accommodated in a case thereof and exhibiting satisfactory operation reliability.
BRIEF SUMMARY OF THE INVENTION
An electronic apparatus according to the present invention comprises a case which accommodates a printed circuit board module, wherein the printed circuit board module comprises:
a metal-type printed circuit board having a metal plate, an insulating-material layer formed on the metal plate and a conductive-material layer formed on the insulating-material layer; and
electronic elements mounted on the metal-type printed circuit board.
In the electronic apparatus according to the present invention and having the above-mentioned structure, heat generated by the electronic elements can effectively be relieved to the case through the conductive-material layer constituting the metal-type printed circuit board. When a forcible cooling portion is provided for the case, heat generated in the electronic elements can furthermore efficiently be radiated. As a result, the rise in the temperatures of the electronic elements can be prevented.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.
REFERENCES:
patent: 4298904 (1981-11-01), Koenig
patent: 4480287 (1984-10-01), Jensen
patent: 4650923 (1987-03-01), Nishigaki
patent: 4730232 (1988-03-01), Lindberg
patent: 4849858 (1989-07-01), Grapes
patent: 4963414 (1990-10-01), Le Vasseur
patent: 5414592 (1995-05-01), Stout
patent: 5432675 (1995-07-01), Sorimachi
patent: 5485353 (1996-01-01), Hayes
patent: 5859764 (1999-01-01), Davis
Cooper & Dunham LLP
Mitsubishi Heavy Industries Ltd.
Tolin Gerald
White John P.
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