Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-11
2009-10-20
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080200, C165S080300, C165S185000, C165S122000, C361S694000, C361S703000
Reexamination Certificate
active
07606027
ABSTRACT:
An electronic apparatus includes a circuit board, circuit elements mounted on the circuit board, and a cooling structure for cooling the circuit elements. The circuit elements include a heat generating element. The cooling structure includes a heat spreader, cooling fins integrally formed with the heat spreader, an air inlet, an air outlet, and a fan device for generating cooling air flowing from the air inlet to the air outlet. The heat spreader is placed above the circuit board and thermally joined to the heat generating element mounted on the circuit board. The cooling fins extend toward the circuit board to provide a plurality of air passages between the circuit board and the heat spreader. The air inlet and outlet communicate with each other through the air passages.
REFERENCES:
patent: 5940272 (1999-08-01), Emori et al.
patent: 6065530 (2000-05-01), Austin et al.
patent: 6219236 (2001-04-01), Hirano et al.
patent: 6348748 (2002-02-01), Yamamoto
patent: 6365964 (2002-04-01), Koors et al.
patent: 6466441 (2002-10-01), Suzuki
patent: 6529375 (2003-03-01), Miyahara et al.
patent: 6657860 (2003-12-01), Matsui et al.
patent: 6847524 (2005-01-01), Tomioka et al.
patent: 7130191 (2006-10-01), Lin et al.
patent: 2005/0057899 (2005-03-01), Lord
patent: 2005/0146851 (2005-07-01), Kajiura
patent: 2006/0144573 (2006-07-01), Nitta et al.
patent: 37 10 198 (1988-10-01), None
patent: 20 2004 003 793 (2004-06-01), None
patent: 102 56 343 (2004-08-01), None
patent: 08-186388 (1996-07-01), None
patent: 2006-332377 (2006-12-01), None
Office Action dated Feb. 13, 2009 in corresponding German patent application No. 10 2007 058 706.8-34 (and English translation).
Denso Corporation
Posz Law Group , PLC
Thompson Gregory D
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