Electronic apparatus and method of manufacturing the same,...

Details Electronic apparatus and method of manufacturing the same,... Electronic apparatus and method of manufacturing the same,...

2008-12-23

2011-11-08

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

08053677

ABSTRACT:
An electronic apparatus includes a multilayer wiring structure having insulating layers and wiring layers which are stacked and having a surface on which an electronic component is mounted, a dipole antenna formed on a surface13A of the multilayer wiring structure, a radiating plate disposed on the surface together with the dipole antenna, and a radiating path formed in the multilayer wiring structure and serving to transfer a heat generated in the electronic component to the radiating plate.

REFERENCES:
patent: 2005/0029666 (2005-02-01), Kurihara et al.
patent: 2000-91717 (2000-03-01), None
patent: 2007-266443 (2007-10-01), None
Machine Translation of JP 2007-266443 A (Oct. 11, 2007), Shinko Electric IND Co Ltd.

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