Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2009-01-29
2009-11-24
Nasri, Javaid (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
C439S083000
Reexamination Certificate
active
07621759
ABSTRACT:
An electronic apparatus is disclosed that includes a board and an electronic component having a body. The board has multiple through-holes and multiple lands covering multiple through-holes. The electronic component has multiple terminals. The terminals are respectively coupled with the lands while a part of each terminal being inserted into a through-hole. A shape of the through-hole is generally circular and different from a part of the land on a back surface of the board. The part of the land on the back surface has a width and the width is different in directions.
REFERENCES:
patent: 7400511 (2008-07-01), Ito et al.
patent: 2007/0193774 (2007-08-01), Ito et al.
patent: 2008/0144260 (2008-06-01), Honda
patent: 2008/0146051 (2008-06-01), Honda
patent: U-5-67049 (1993-09-01), None
patent: A-11-317265 (1999-11-01), None
patent: A-2001-358441 (2001-12-01), None
patent: A-2007-27242 (2007-02-01), None
Honda Takayoshi
Ito Dai
DENSO CORPORATION
Nasri Javaid
Posz Law Group , PLC
LandOfFree
Electronic apparatus and method of manufacturing electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic apparatus and method of manufacturing electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic apparatus and method of manufacturing electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4073909