Electronic apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S719000, C257S715000, C174S015200, C165S104260, C165S104330

Reexamination Certificate

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07961467

ABSTRACT:
An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board.

REFERENCES:
patent: 6257328 (2001-07-01), Fujiwara et al.
patent: 7460370 (2008-12-01), Cheng et al.
patent: 7535712 (2009-05-01), Tanaka
patent: 2004/0001316 (2004-01-01), Kamikawa et al.
patent: 2007/0006996 (2007-01-01), Mikubo et al.
patent: 2008/0093056 (2008-04-01), Hwang et al.
patent: 2008/0156460 (2008-07-01), Hwang et al.
patent: 05-264185 (1993-10-01), None
patent: 6304066 (1994-11-01), None
patent: 2000106495 (2000-04-01), None
patent: 2005-136197 (2005-05-01), None
patent: 2006324470 (2006-11-01), None
patent: 2007-034699 (2007-02-01), None
patent: 2007142294 (2007-06-01), None
patent: 2007323160 (2007-12-01), None
patent: 2008-196787 (2008-08-01), None
Japanese Patent Application No. 2009-082340, Notification of Reasons for Refusal, mailed Aug. 24, 2010, (English Translation).

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