Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-14
2011-06-14
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C257S715000, C174S015200, C165S104260, C165S104330
Reexamination Certificate
active
07961467
ABSTRACT:
An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board.
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Japanese Patent Application No. 2009-082340, Notification of Reasons for Refusal, mailed Aug. 24, 2010, (English Translation).
Blakely , Sokoloff, Taylor & Zafman LLP
Chervinsky Boris L
Kabushiki Kaisha Toshiba
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