Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-09-29
1997-01-07
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165 804, 165185, 257713, 361690, 361699, H05K 720
Patent
active
055923631
ABSTRACT:
An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.
REFERENCES:
patent: 4674004 (1987-06-01), Smith et al.
patent: 4777560 (1988-10-01), Herrell et al.
IBM Tech. Disclosure Bulletin, "Buffered Immerson Cooling With Buckling Bellows Providing Barrier Between Chip And System Coolant and Pressure", vol. 32, No. 8A, Jan. 1990, pp. 1-3.
Atarashi Takayuki
Daikoku Takahiro
Hatada Toshio
Hayashi Yoshito
Iino Toshiki
Hitachi , Ltd.
Thompson Gregory D.
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