Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-01-15
2000-08-29
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361697, 361698, 361700, 361717, 257713, 257717, 174 151, 174 163, 16510421, 16510433, H05K 720
Patent
active
061117501
ABSTRACT:
Electronic apparatus is contained in a heat dissipative external enclosure 2. The enclosure contains at least one unit contained in a thermally conductive internal housing 4,6 providing RF isolation and mounted on a wall 7 of the enclosure in thermal contact therewith. A wall 11 of the unit has a first recess 14 receiving the evaporator 13 of a heat pipe 12. The heat pipe is clamped between the external enclosure and the internal housing. The condenser 22 of the heat pipe is lower than the evaporator and is received by a recess 24 in the wall 7. The evaporator is clamped in the recess by a clamp member e.g. another unit 6.
Because the heat pipe is clamped at its ends, it does not need to be an interference fit in either recess and may thus easily be removed. The inner housing can maintain RF isolation.
REFERENCES:
patent: 5764483 (1998-06-01), Ohashi et al.
Datskovsky Michael
Lucent Technologies - Inc.
Picard Leo P.
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